industry news
Subscribe Now

MoSys Participates at The Linley Group’s Tech Processor Conference

Who:         MoSys (NASDAQ: MOSY), a leading provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, is participating at The Linley Group’s Tech Processor Conference, which focuses on networking and communications. Michael Miller, Vice President of Technology Innovation and System Applications at MoSys,will be a panelist on the second day of the conference in Session 5: Scaling Processing to 100Gbps. This session, which begins at 9 a.m., will be moderated by Linley Gwennap, principal analyst at The Linley Group. Presenters will describe products and technologies capable of data rates beyond 40 Gbps.

What:       The Linley Tech Processor Conference returns to San Jose. This two-day event focuses on processors and related technologies for networking and communications applications. Industry leaders will deliver in-depth information on the newest chips and technologies. Attendees will hear presentations addressing various types of processor architecture and design, semiconductor intellectual property and related technologies used in these applications.

When:       September 27–28, 2010 beginning at 8:15 a.m. On September 27 at 5 p.m. there will be a reception and exhibits.

Where:    Doubletree Hotel San Jose

2050 Gateway Place
San Jose, CA 95110

About MoSys, Inc.

MoSys, Inc. (NASDAQ: MOSY) is a leading provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs. MoSys’ Bandwidth Engine™ family of ICs combines the company’s patented 1T-SRAM® high-density memory technology with its high-speed 10 Gigabits per second (Gbps) SerDes interface (I/O) technology. A key element of Bandwidth Engine technology is the GigaChip™ Interface, an open, CEI-11 compatible interface developed to enable highly efficient serial chip-to-chip communications. MoSys’ IP portfolio includes SerDes IP and DDR3 PHYs that support data rates from 1 – 11 Gbps across a variety of standards. In addition, MoSys offers its flagship, patented 1T-SRAM and 1T-Flash® memory cores, which provide a combination of high-density, low power consumption, high-speed and low cost advantages for high-performance networking, computing, storage and consumer/graphics applications. MoSys IP is production-proven and has shipped in more than 325 million devices. MoSys is headquartered in Santa Clara, California. More information is available on MoSys’ website at http://www.mosys.com.

Leave a Reply

featured blogs
Dec 19, 2024
Explore Concurrent Multiprotocol and examine the distinctions between CMP single channel, CMP with concurrent listening, and CMP with BLE Dynamic Multiprotocol....
Dec 20, 2024
Do you think the proton is formed from three quarks? Think again. It may be made from five, two of which are heavier than the proton itself!...

Libby's Lab

Libby's Lab - Scopes Out Silicon Labs EFRxG22 Development Tools

Sponsored by Mouser Electronics and Silicon Labs

Join Libby in this episode of “Libby’s Lab” as she explores the Silicon Labs EFR32xG22 Development Tools, available at Mouser.com! These versatile tools are perfect for engineers developing wireless applications with Bluetooth®, Zigbee®, or proprietary protocols. Designed for energy efficiency and ease of use, the starter kit simplifies development for IoT, smart home, and industrial devices. From low-power IoT projects to fitness trackers and medical devices, these tools offer multi-protocol support, reliable performance, and hassle-free setup. Watch as Libby and Demo dive into how these tools can bring wireless projects to life. Keep your circuits charged and your ideas sparking!

Click here for more information about Silicon Labs xG22 Development Tools

featured chalk talk

High Power Charging Inlets
All major truck and bus OEMs will be launching electric vehicle platforms within the next few years and in order to keep pace with on-highway and off-highway EV innovation, our charging inlets must also provide the voltage, current and charging requirements needed for these vehicles. In this episode of Chalk Talk, Amelia Dalton and Drew Reetz from TE Connectivity investigate charging inlet design considerations for the next generation of industrial and commercial transportation, the differences between AC only charging and fast charge and high power charging inlets, and the benefits that TE Connectivity’s ICT high power charging inlets bring to these kinds of designs.
Aug 30, 2024
36,124 views