Boxes to Boards and Back Again

Technology Transitions, VPX, and the Challenges of SoCs in Embedded Design

by Amelia Dalton

Consolidation and innovation in embedded design is the name of the game for this week’s Fish Fry. We chat with Ken Grob (Elma Electronics) about VPX, getting your box design onto a board, and the many advantages of implementing a system on chip or system on module in your next embedded design. In a special “This isn’t an April Fools’ joke” edition of News You May Have Missed, we investigate how the foam created by a tiny frog from Trinidad may revolutionize antibiotic delivery. Also this week, we check out the many challenges and alternatives for thermal management.

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Links for April 1, 2016

More information about Elma Electronic

Using Frog Foam to Deliver Antibiotics

New Episode of Chalk Talk: Thermal Management

Introducing FPGAi – Innovations Unlocked by AI-enabled FPGAs

Quantized Neural Networks for FPGA Inference

Sponsored by Intel

Implementing a low precision network in FPGA hardware for efficient inferencing provides numerous advantages when it comes to meeting demanding specifications. The increased flexibility allows optimization of throughput, overall power consumption, resource usage, device size, TOPs/watt, and deterministic latency. These are important benefits where scaling and efficiency are inherent requirements of the application.

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featured chalk talk

Reliability: Basics & Grades

Sponsored by Mouser Electronics and YAGEO Group

Reliability is cornerstone to all electronic designs today, but how reliability is implemented and determined can vary widely by different market segments. In this episode of Chalk Talk, Amelia Dalton and Sam Accardo from the YAGEO Group explore the definition of reliability for electronic components, investigate the different grades of reliability offered by the YAGEO Group and the various steps that the YAGEO Group is taking to ensure the greatest reliability of their components.

Click here for more information about KEMET Space, Avionics, & Defense Components

Aug 15, 2024

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Boxes to Boards and Back Again

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