What Might Make an Accelerometer More Robust?
Last month STMicroelectronics announced a new accelerometer “engineered to withstand stresses of modern mobile life.” They see those stresses arising from increasingly thinner phones and the mechanical and thermal challenges they cause. They called out board bending as a particular challenge to the mechanical integrity of the works inside the accelerometer package.
So how do you improve the mechanical structure of the accelerometer to do this? First, it helps to realize that there are two structures in ST’s accelerometers. One operates in-plane and provides both x and y acceleration information. A separate structure … Read More → "What Might Make an Accelerometer More Robust?"