Data center and AI data center solutions
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Collapse all subcategories Expand all subcategoriesReduce TCO, increase efficiency and power density, and ensure reliability and uptime with Infineon solutions for green data centers, from grid to core
Expected to increase to 7% of global electricity usage by 2030, data center power demand is one of the most important societal questions to answer. As our world becomes more and more digital, the demand for computing - storing and networking will continue to increase. Meanwhile, many data centers will become AI factories - focused on AI training and inferencing. This will impact the power demands and reshape the AI infrastructure, both inside and outside the server rack.
TCO/OPEX and efficiency increases are crucial aspects to consider in this industry, where even a single-digit percentage decrease in electricity purchasing can mean hundreds of thousand of dollars in annual savings for operators.
As a leader in power that is committed to decarbonization and digitalization, Infineon is perfectly positioned to help solve this equation, using our mastery of the three main semiconductor technologies, Si, SiC, and GaN, and more than thirty years of experience in power systems. Together, this powerful combination results in higher efficiency, reduced power demand, and cost savings.
Data processing system for computing and data storage
Infineon's solutions leverage Silicon, GaN, and SiC to deliver the best combination of efficiency, power density, and system cost at each stage of the PSU to support single or three phase power grid systems. In particular, the use of SiC and GaN devices in PSU architectures enables higher switching frequencies, lower losses, and improved thermal performance, while Si devices are used in the slow leg of the power factor correction (PFC) stage where their low RDS(on) and high current capability are beneficial.
Our semiconductor portfolio offers a range of power ratings, soon spanning up to 12 kW and beyond, working towards the goal of achieving 1 MW per rack. They achieve an impressive benchmark efficiency of ~98%, all while meeting strict hold-up time requirements. Infineon is the only player able to offer solutions and expertise across all technologies, including a consistent packaging selection to ease mechanical design and enable top-side cooling to deal with the challenge of thermals in the PSU. A wide set of multi-phase/level PFCs and resonant DC-DC topologies are supported.
A variety of reference designs are available to shorten PSU development effort and time-to-market.
Due to the length and complexity of modern data center tasks, safeguarding uninterrupted operation is a crucial task.
BBUs are critical for providing a reliable source of power in the event of an outage or grid failure, ensuring continuous operation of AI workloads. Infineon's battery backup unit solutions leverage advanced converter architectures to minimize size and maximize output power capability and efficiency. They are based on a partial power concept and can be customized depending on the battery configuration, enabling efficient, reliable, and scalable power conversion and ensuring uninterrupted operation of these critical facilities.
Designed to deliver unmatched reliability and uptime for power supplies, our power system reliability monitoring (PSRM) solutions minimize the risk of outages and consequently lower the total cost of ownership (TCO) for servers. By enabling real-time power supply health monitoring and lifetime estimation, PSRM provides valuable insights based on dynamic system parameter logging. These can be used to improve device utilization, maintenance, and the early detection of potential downtimes, enabling proactive measures to prevent them.
Infineon's digital hot-swap controllers provide a wide range of protection and monitoring features including digital SOA control, which is essential in safeguarding against inrush current and fault conditions in high-availability systems. These devices are optimized for AI servers to allow safe insertion and removal of server blades without shutting down the systems, minimizing downtime and maintaining continuous operation of AI workloads. High-precision AFE, such as current and voltage ADCs and PMBus for telemetry, enables accurate monitoring and reporting of the power and energy usage in a typical server rack system. This allows OEMs/operators to remotely monitor each rack individually for a more efficient system operation, thus resulting in energy saving and minimized system downtime. Infineon’s XDP™ digital controllers alongside with OptiMOS™ LinearFETs with low RDS(on) and strong SOA capability, provide scalable and robust protection.
Our portfolio will soon expand to include eFuses, which integrate Infineon MOSFETs and current and temperature sensors into one package to reduce design time and BOM cost. This will result in simpler designs and smaller footprints.
Infineon solutions for power path protection
Transforming the electrical flow from the high voltage server PSU into a more manageable lower voltage is primarily the role of the Intermediate Bus Converter, or IBC for short. The specificity of the application, as well as the extremely limited space on accelerator cards and the very high power requirement drives the need for high power density and efficiency. Further, the load dynamics of the accelerator IC can be wide with peak power nearly double the average. As a result, the combination of high power density, efficiency, and peak power is driving tremendous innovation in the power conversion industry.
Infineon's innovative, proprietary topologies - both regulated and unregulated DC-DC converters - have been successfully integrated into 48 V Intermediate Bus Converter (IBC) solutions on leading AI card platforms. They currently support power levels of up to 1.5 kW, with a roadmap to scale up to 3 kW in the near future. The higher conversion ratios of the IBC, together with OptiMOS™ dual-phase power modules, are key enablers of high density vertical power delivery (VPD). Highest current density dual-phase power modules reducing the TCO of Generative AI data centers.
Converting electrical flow from the IBC down to the very low voltages used in the core requires dedicated components and systems. These functions are needed for traditional data centers as well as those used in GenAI applications. Infineon features solutions for CPUs, FPGAs, top of rack switches, AI accelerator cards, and Smart Network Interface cards (Smart NIC). Our distinct product offering includes power and control solutions such as dual- and quad-phase power modules, digital power controllers, integrated power stages, and analog and digital integrated Point-of-Loads (PoLs). In order to meet the demanding requirements of the latest AI server generations, these solutions ensure best-in-class efficiency, power density, and thermal performance.
On top of that, and due to the rising power demands and energy cost of AI GPU (Graphic Processor Unit) platforms, Infineon Introduces the third generation of DC-DC power modules: TDM2454xx OptiMOS™ quad-phase power modules 280 A, enabling true vertical power delivery (VPD) and offering a best-in-class power density of 2.0A/mm2 in a compact 10x9x5 mm package.
Key takeaways:
- Know the key features of Infineon’s fast COT digital IPOL family TDA38xxx featuring OptiMOS™
- Be able to choose the most suitable part of this family for your application
The increasing power demand for AI servers requires ultra-high-effiiciency AC/DC power supplies in a small form factor design with more power delivered to the motherboard. By using the best in class WBG and silicon devices with digital control, Infineon‘s 3.3kW PSU reference design can meet the Titanium® PSU spec in a very compact form factor.
