IC design has come a very long way in a short amount of time. Today, our SoC designs frequently include integrated analog, 100+ Gigabit data rates and 3D stacked DRAM integrated into our SoCs on interposers. In order to keep our heads above water in all of this IC complexity, we need a unified circuit simulation workflow and a fast signoff SPICE and FastSPICE architecture. In this episode of Chalk Talk, Amelia Dalton chats with Hany Elhak from Synopsys about how the unified workflow of the PrimeSim Continuum from Synopsys can help you address systematic and scale complexity for your next IC design.

Click here for more information about PrimeSim Continuum