editor's blog
Subscribe Now

Custom Chip Planning

Digital designers have had semi-automated design flows for a long time; custom and analog designers, not so much.

Pulsic recently announced that they’re taking some of the custom EDA technology they’ve had for ten years, combining it with new technology, and integrating it into a flow as their Pulsic Planning Solution. I got a chance to talk to them about it at DAC.

Their solution consists of four components:

  • a hierarchical floorplanner, the Unity Chip Planner;
  • a power grid planner, the Unity Power Planner, which can handle multiple domains;
  • a tool for planning bus routing and layer, the Unity Bus Planner;
  • and a tool for any signal that’s not a bus, the Unity Signal Planner.

They tie into other tools via OpenAccess. They claim to address pretty much any part of the design flow except taking RTL and turning it into GDS-II. They can feed parasitics and signal integrity info into the planning tools to refine the results. The planning process is iterative; each refinement will feed either a better estimate or an actual value to update the overall plan.

They claim that this is the only planning solution specifically targeted for the custom digital or analog space: ASIC tools can sometimes fake it, but don’t do so well with some of the aspect ratios and other idiosyncrasies of custom design.

More info in their recent release

Leave a Reply

featured blogs
Apr 25, 2024
Cadence's seven -year partnership with'¯ Team4Tech '¯has given our employees unique opportunities to harness the power of technology and engage in a three -month philanthropic project to improve the livelihood of communities in need. In Fall 2023, this partnership allowed C...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Accessing AWS IoT Services Securely over LTE-M
Developing a connected IoT design from scratch can be a complicated endeavor. In this episode of Chalk Talk, Amelia Dalton, Harald Kröll from u-blox, Lucio Di Jasio from AWS, and Rob Reynolds from SparkFun Electronics examine the details of the AWS IoT ExpressLink SARA-R5 starter kit. They explore the common IoT development design challenges that AWS IoT ExpressLink SARA-R5 starter kit is looking to solve and how you can get started using this kit in your next connected IoT design.
Oct 26, 2023
23,607 views