Another Way to Test Your 3D ICs

by Jim Turley

A couple months back we looked at Mentor’s approach to testing 3D ICs. Cadence and Imec have recently announced an automated solution for testing 3D ICs. Their methodology accounts for various stages of assembly and test, including pre-bond, mid-bond, post-bond, and post-packaging, providing “test wrappers” for each of these. Insertion of these wrappers into the chip design is claimed to take less than 0.2% additional die area.

More info in their release…

Arduino Portenta Environmental Monitoring Bundle

Sponsored by Mouser Electronics and Arduino

Join Libby and Demo in this episode of “Libby’s Lab” as they explore the Arduino Portenta Environmental Monitoring Bundle, available at Mouser.com! This bundle is perfect for engineers requiring environmental data such as temperature, humidity, and pressure. Designed for ease of use, the bundle is great for IoT, smart home, and industrial devices, and it includes WiFi and Bluetooth connectivity. Keep your circuits charged and your ideas sparking!

Click here for more information about Arduino Portenta Environmental Monitoring Bundle

featured chalk talk

Developing a Secured Matter Device with the OPTIGA™ Trust M MTR Shield

Sponsored by Mouser Electronics and Infineon

In this episode of Chalk Talk, Amelia Dalton and Johannes Koblbauer from Infineon explore how you can add Matter and security to your next smart home project with the OPTIGA™ Trust M MTR shield. They also investigate the steps involved in the OPTIGA™ Trust M Matter design process, the details of the OPTIGA™ Trust M Matter evaluation board and how you can get started on your next Matter IoT device.

Click here for more information about Infineon Technologies OPTIGA™ Trust M MTR Shield

Jul 2, 2024

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Another Way to Test Your 3D ICs

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