Efinix co-packages FPGA with SDRAM to shrink board-level real estate footprint
Efinix has just done designers a solid. The company’s new Ti180J484D1 FPGA incorporates a 2Gbit LPDDR4X SDRAM die co-packaged with the FPGA die, which creates a System in Package (SiP) device that results in a smaller footprint on your circuit board. In addition, you won’t need to worry about the precise pcb trace-length matching that’s required to properly connect the DDR SDRAM to the FPGA. Efinix has handled that for you already. The idea’s similar to those high-end FPGAs from other vendors that package HBM (high-bandwidth memory) DRAM stacks with … Read More → "Efinix co-packages FPGA with SDRAM to shrink board-level real estate footprint"