SEATTLE, Aug. 24 /PRNewswire/ — MPC Data, a Gold-level member of the Microsoft Windows® Embedded Partner Program, announced the release to the market of a range of Microsoft Windows Embedded CE 6.0 R3 Board Support Packages (BSPs). These new BSPs are available for Texas Instruments Incorporated (TI) OMAP-L137, OMAP-L138, and Sitara™ ARM®9 AM18x and AM17x processors and evaluation modules (EVMs).
TI’s OMAP-L1x devices are a range of low-power applications processors based on an ARM926EJ-S™ and the TMS320C674x DSP core, which is significantly lower power than other members of the C6000™ DSP platform. The multi-core architecture of the device family provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies.
TI’s ARM-only Sitara AM17x and AM18x families of devices share a common ARM926EJ-S core and rich peripheral set with the OMAP-L1x devices, offering the same high performance and low power benefits but without a C674x DSP core.
The BSPs, with integrated device drivers for all standard interfaces available on the EVMs, enable application developers to port their Windows Embedded CE-based software onto the EVMs with minimal development effort and risk. MPC Data’s BSPs are the key starting point for OEMs developing differentiated Windows Embedded CE-based devices with rich user experiences and streamlined connectivity to Windows PCs, servers and online services. The BSPs offer a robust solution for OEMs needing to have a complete Windows Embedded CE solution up and running as quickly as possible.
In addition to the range of BSPs, MPC Data has worked with TI to provide a full online support infrastructure, allowing customers not only to download the BSPs but also gain access free online support and user forums during their evaluation period.
For BSP software download, documentation and further information on the Windows Embedded CE 6.0 R3 support for TI’s OMAP-L1x and AM1x processors visit http://support.mpcdata.com/ti/.
Tom Kelly, director, software partner network at TI comments, “TI is very excited to be working again with both MPC Data and Microsoft to bring the latest Windows Embedded OS support to the TI processor family. The OMAP-L1x and Sitara AM1x generations have been embraced by the OEM developer community, and our work with MPC Data on this BSP shows our continued commitment to bringing the latest technology with specialist support to market.”
Kim Chau, senior partner, marketing manager for Windows Embedded at Microsoft Corp, said “Microsoft is pleased to work with MPC Data by helping OEMs deliver rich, immersive user experiences and seamless connectivity to the world of Windows. Windows Embedded CE 6.0 R3 with Silverlight for Windows Embedded and other advanced features, combined with MPC Data’s proven track record in developing BSPs for the TI range of devices, helps reduce time-to-market while driving innovative, differentiated devices for consumers and the enterprise.”
Frank Breeze, COO, MPC Data Inc., added, “The close -relationship between TI, Microsoft and MPC Data provides a clear demonstration of how members of the Windows Embedded partner ecosystem can work together to provide fully featured, cost effective solutions to the market in a rapid time frame. “He went on to say, “We believe that the support infrastructure that we offer in addition to BSPs is a first in this market place, giving developers an unprecedented development experience.”
About MPC Data
MPC Data helps embedded device makers worldwide get high-quality products to market faster, with lower risk and more cost effectively.
We offer services in software and hardware engineering from proof of concept to volume production, with a strong emphasis on embedded and real-time developments. With many years of experience in Windows Embedded, Embedded Linux and RTOSs, and thanks to its close partnerships with Microsoft and leading semiconductor vendors, MPC Data is the key partner for OEMs, offering consultation, software & hardware design, integration services, products and training.
