feature article
Subscribe Now

Embedded Signal Processing Capabilities of the LatticeECP3 sysDSP Block

Enhanced DSP Capabilities

The success of the LatticeECP2M family in addressing the 2G/3G wireless arena, coupled with discussions with customers, has served to drive the architectural improvements made in the LatticeECP3 DSP block. Several key points have been addressed. First and foremost, backward compatibility has been maintained with the current LatticeECP2/M DSP. There is also finer control of the DSP functions, which increases overall DSP block performance. The following sections of this white paper will outline each targeted feature, and how the LatticeECP3 family provides superb overall performance for many signal processing applications.

Figure 1 below provides a high level diagram of the major data flow differences between the LatticeECP2/M and LatticeECP3 DSP block.

Leave a Reply

featured blogs
May 2, 2025
I can safely say that I've never seen a wheeled-legged robot that can handle rugged terrains, muddy wetlands, and debris-strewn ruins like this...

featured paper

How Google and Intel use Calibre DesignEnhancer to reduce IR drop and improve reliability

Sponsored by Siemens Digital Industries Software

Through real-world examples from Intel and Google, we highlight how Calibre’s DesignEnhancer maximizes layout modifications while ensuring DRC compliance.

Click here for more information

featured chalk talk

Fiber Optics for Embedded Computing
In this episode of Chalk Talk, Anders Thelin from TE Connectivity and Amelia Dalton explore the benefits that TE Connectivity connector solutions can bring to fiber optic embedded designs. They also investigate the various VITA standards utilized for these kinds of designs, and how optical fiber routing and active optics solutions from TE Connectivity can be used to further enhance the performance of your next design.
Apr 21, 2025
28,880 views