industry news
Subscribe Now

CEVA Introduces Digital Video Stabilizer Software Module for CEVA-MM3000 Imaging & Vision Platforms Targeting Next Generation Smartphones and Mobile Devices

MOUNTAIN VIEW, Calif., – August 5, 2013 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of its digital video stabilizer (DVS) software module for theCEVA-MM3000 imaging and vision platforms, bringing advanced imaging capabilities to next generation smartphones and mobile devices. The DVS module is fully optimized to run in real-time using minimal processing workloads and very low memory bandwidth on the CEVA-MM3000 platforms. For example, in a 28nm process, the CEVA-MM3101 consumes less than 35mW power while running DVS on a 1080p30 fps video stream in real-time. Addressing higher resolution requirements, the DVS module scales up to 4K Ultra-HD video streams on a single CEVA-MM3101 platform.

CEVA’s DVS software module reduces the shakiness resulting from motion typically experienced when using the video and imaging functions in handheld devices such as smartphones and cameras. Features supported include rolling shutter (“Jello Effect”) and multiple axis correction, which reduce shakiness and smooth motion when panning, zooming and rotating, in any light conditions. The DVS module was implemented utilizing CEVA’s new Application Developer Kit (ADK), which was also announced today in a separate press release. The ADK serves to substantially simplify the overall software development experience, shortening the product design cycle and providing significant memory bandwidth and power consumption savings for imaging and vision applications.

Eran Briman, vice president of marketing at CEVA, commented: “Mobile device manufacturers are constantly on the lookout for differentiating features, most of which are aimed at enabling unique computational photography and vision applications. But even more important is the need to quickly implement such new features to meet product life cycles shorter than six months. Our DVS software module clearly illustrates the added value that the programmable CEVA-MM3000 family of imaging and vision platforms brings to OEMs, who can leverage the inherently low power consumption of DSPs to integrate advanced computational photography capabilities, in a timely and cost-efficient manner. Furthermore, our DVS module can be easily coupled with additional imaging software modules on the fully programmable CEVA-MM3000 platform such as Super-Resolution, Color Enhancement and High Dynamic Range.”

Sample streams and more details on CEVA’s DVS software module are available at http://www.ceva-dsp.com/DVS. 

About CEVA, Inc.

CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA’s IP was shipped in over 1.1 billion devices, powering smartphones from many of the world’s leading OEMs, including HTC, Huawei, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.


Leave a Reply

featured blogs
Jul 11, 2025
Can you help me track down the source of the poem titled 'The African Tigger is Fading Away'?...

Libby's Lab

Libby's Lab - Scopes out Littelfuse C&K Aerospace AeroSplice Connectors

Sponsored by Mouser Electronics and Littelfuse

Join Libby and Demo in this episode of “Libby’s Lab” as they explore the Littelfuse C&K Aerospace Aerosplice Connectors, available at Mouser.com! These connectors are ideal for high-reliability easy-to-use wire-to-wire connections in aerospace applications. Keep your circuits charged and your ideas sparking!

Click here for more information

featured paper

Agilex™ 3 vs. Certus-N2 Devices: Head-to-Head Benchmarking on 10 OpenCores Designs

Sponsored by Altera

Explore how Agilex™ 3 FPGAs deliver up to 2.4× higher performance and 30% lower power than comparable low-cost FPGAs in embedded applications. This white paper benchmarks real workloads, highlights key architectural advantages, and shows how Agilex 3 enables efficient AI, vision, and control systems with headroom to scale.

Click to read more

featured chalk talk

Advantech Dual Band WiFi
Sponsored by Mouser Electronics and Advantech
In this episode of Chalk Talk, Amelia Dalton and Monica Goode from Advantech investigate the what, where, and how of dual band WiFi. They also explore the benefits that dual band WiFi can bring to a variety of embedded designs and how you can take advantage of Advantech dual band WiFi solutions for your next design.
Jul 31, 2024
84,054 views