editor's blog
Subscribe Now

Another Way to Test Your 3D ICs

A couple months back we looked at Mentor’s approach to testing 3D ICs. Cadence and Imec have recently announced an automated solution for testing 3D ICs. Their methodology accounts for various stages of assembly and test, including pre-bond, mid-bond, post-bond, and post-packaging, providing “test wrappers” for each of these. Insertion of these wrappers into the chip design is claimed to take less than 0.2% additional die area.

More info in their release

Leave a Reply

featured blogs
Dec 2, 2024
The Wi-SUN Smart City Living Lab Challenge names the winners with Farmer's Voice, a voice command app for agriculture use, taking first place. Read the blog....
Dec 3, 2024
I've just seen something that is totally droolworthy, which may explain why I'm currently drooling all over my keyboard....

featured video

Introducing FPGAi – Innovations Unlocked by AI-enabled FPGAs

Sponsored by Intel

Altera Innovators Day presentation by Ilya Ganusov showing the advantages of FPGAs for implementing AI-based Systems. See additional videos on AI and other Altera Innovators Day in Altera’s YouTube channel playlists.

Learn more about FPGAs for Artificial Intelligence here

featured paper

Quantized Neural Networks for FPGA Inference

Sponsored by Intel

Implementing a low precision network in FPGA hardware for efficient inferencing provides numerous advantages when it comes to meeting demanding specifications. The increased flexibility allows optimization of throughput, overall power consumption, resource usage, device size, TOPs/watt, and deterministic latency. These are important benefits where scaling and efficiency are inherent requirements of the application.

Click to read more

featured chalk talk

Machine Learning on the Edge
Sponsored by Mouser Electronics and Infineon
Edge machine learning is a great way to allow embedded devices to run applications that can collect sensor data and locally process that data. In this episode of Chalk Talk, Amelia Dalton and Clark Jarvis from Infineon explore how the IMAGIMOB Studio, ModusToolbox™ Software, and PSoC and AURIX™ microcontrollers can help you develop a custom machine learning on the edge application from scratch. They also investigate how the IMAGIMOB Studio can help you easily develop and deploy AI/ML models and the benefits that the PSoC™ 6 Artificial Intelligence Evaluation Kit will bring to your next machine learning on the edge application design process.
Aug 12, 2024
56,196 views