Another Way to Test Your 3D ICs

by Jim Turley

A couple months back we looked at Mentor’s approach to testing 3D ICs. Cadence and Imec have recently announced an automated solution for testing 3D ICs. Their methodology accounts for various stages of assembly and test, including pre-bond, mid-bond, post-bond, and post-packaging, providing “test wrappers” for each of these. Insertion of these wrappers into the chip design is claimed to take less than 0.2% additional die area.

More info in their release…

Arduino Portenta Environmental Monitoring Bundle

Sponsored by Mouser Electronics and Arduino

Join Libby and Demo in this episode of “Libby’s Lab” as they explore the Arduino Portenta Environmental Monitoring Bundle, available at Mouser.com! This bundle is perfect for engineers requiring environmental data such as temperature, humidity, and pressure. Designed for ease of use, the bundle is great for IoT, smart home, and industrial devices, and it includes WiFi and Bluetooth connectivity. Keep your circuits charged and your ideas sparking!

Click here for more information about Arduino Portenta Environmental Monitoring Bundle

featured chalk talk

Power Modules and Why You Should Use Them in Your Next Power Design

Sponsored by Mouser Electronics and Texas Instruments

In this episode of Chalk Talk, Amelia Dalton and Christine Chacko from Texas Instruments explore a variety of power module package technologies, examine the many ways that power modules can help save on total design solution cost, and the unique benefits that Texas Instruments power modules can bring to your next design.

Click here for more information about Texas Instruments TPSM336x5 Synchronous Buck Converter Power Module

Aug 22, 2024

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Another Way to Test Your 3D ICs

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