Event-based image sensor cuts processing power requirements by one or two orders of magnitude
I last wrote about Prophesee’s event-based vision sensor at the end of 2023. (See “Prophesee’s 5th Generation Sensors Detect Motion Instead of Images for Industrial, Robotic, and Consumer Applications.”) Back then, I wrote about the company’s fifth generation 320×320-pixel GenX320 sensor, which captures changes in light on a per-pixel basis rather … Read More → "Event-based image sensor cuts processing power requirements by one or two orders of magnitude"
Wow! AI-Powered “Sketch-on-Napkin” to Embedded Design
I was just thinking about the 1871 book Through the Looking-Glass, and What Alice Found There by mathematician, logician, Anglican deacon, writer, and photographer, the Reverend Charles Lutwidge Dodgson (a.k.a. Lewis Carroll).
Lewis Carroll’s Alice’s Adventures in Wonderland and Through the Looking-Glass continue to influence us today, not just as beloved children’s stories … Read More → "Wow! AI-Powered “Sketch-on-Napkin” to Embedded Design"
Efinix co-packages FPGA with SDRAM to shrink board-level real estate footprint
Efinix has just done designers a solid. The company’s new Ti180J484D1 FPGA incorporates a 2Gbit LPDDR4X SDRAM die co-packaged with the FPGA die, which creates a System in Package (SiP) device that results in a smaller footprint on your circuit board. In addition, you won’t need to worry about the precise pcb trace-length matching that’s required to properly connect the DDR … Read More → "Efinix co-packages FPGA with SDRAM to shrink board-level real estate footprint"
Headed to the Skies! High Speed Data Transmission for Aerospace Designs
This week’s podcast is all about high speed data transmission in aerospace applications! My podcast guests this week are Christian Hobmaier and Thomas Mittermeier from ODU connectors. Christian, Thomas and I explore the biggest challenges in this arena, the innovative new connector solutions ODU offers to support these kinds of designs, and the details of ODU’s rigorous testing that includes a technique called the “Arizona Dust Test”. … Read More → "Headed to the Skies! High Speed Data Transmission for Aerospace Designs"
Artificial Intelligence (AI) Meets Networks-on-Chip (NoCs) in More Ways Than One
Way back in the mists of time that we used to call 2023, I wrote (well, waffled) a column about Network-on-Chip (NoC) technology (see Who Needs a Network-on-Chip (NoC)? Everyone!). Suffice it to say that this was in the days before the punctuation police forbade me from using exclamation marks in my titles (thankfully, I’ … Read More → "Artificial Intelligence (AI) Meets Networks-on-Chip (NoCs) in More Ways Than One"










