editor's blog
Subscribe Now

An Opening for MEMS PDKs

iStock_000025762659_Small.jpgCoventor recently announced the latest release of MEMS+, their MEMS EDA/CAD tool, and the timing was tough because it came just after I had an article involving process design kits (PDKs). And amongst the things that the latest MEMS+ release brings is movement towards MEMS PDKs (MPDKs).

MEMS devices are, of course, notorious for evading any attempts to rope in process and design options through standardization of any kind. Efforts continue, but it remains a challenge.

This means that any MEMS design involves a collaboration between a particular fab (captive or foundry) and the design folks to come up with a physical design that meets the requirements for a particular new sensor or actuator. And what’s done for some new design may have nothing to do with what has been done in the past. Materials may change, dimensions and shapes may change, and circuits and packages may change. Everything’s negotiable.

With the latest release of MEMS+, Coventor says that they’re enabling the use of PDKs for well-established sensors – IMUs, devices built on Leti’s MnNEMS process, and piezoelectric devices. The MPDK isn’t standardized, but then again, silicon circuit PDKs have also taken a long time to move towards standardization.

So Coventor is working, initially, with one fab and EDA company at a time, starting with XFAB and Cadence. You may recall from the silicon side that the first step away from incompatible PDKs for each tool/foundry combination was for a single foundry to unify its PDKs for all tools. So initially, for example, TSMC PDKs were different for Cadence, Synopsys, and Mentor tools, and then TSMC worked to unify the format.

But the result worked only at TSMC; GlobalFoundries and other fabs would have their own formats, even if unified across tools. This is the issue that the OpenPDK project has tackled since 2010.

This is the path that MPDKs are likely to take, according to Coventor. It would be nice if the lessons of the past allowed us to bypass some of the effort replication. For instance, if XFAB gets something going, it sure would be nice to use that as the basis for someone else, layering on change and generalizing rather than starting from scratch or even turning the XFAB-only MPDK into a similar-but-incompatible someone-else-only MPDK.

You can read more about this and the other new features in MEMS+ 6.0 in Coventor’s announcement.

Leave a Reply

featured blogs
Apr 19, 2024
In today's rapidly evolving digital landscape, staying at the cutting edge is crucial to success. For MaxLinear, bridging the gap between firmware and hardware development has been pivotal. All of the company's products solve critical communication and high-frequency analysis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Introduction to the i.MX 93 Applications Processor Family
Robust security, insured product longevity, and low power consumption are critical design considerations of edge computing applications. In this episode of Chalk Talk, Amelia Dalton chats with Srikanth Jagannathan from NXP about the benefits of the i.MX 93 application processor family from NXP can bring to your next edge computing application. They investigate the details of the edgelock secure enclave, the energy flex architecture and arm Cortex-A55 core of this solution, and how they can help you launch your next edge computing design.
Oct 23, 2023
23,598 views