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Next-Generation Packaging for CRM Applications

With smaller electronics, more options can be fit into the package, allowing for features such as RF transceivers for wireless communication, advanced sensors to optimally time pacing and defibrillation shocks and backup systems in case the main system fails. While integrated circuits (ICs) have taken advantage of advances in dense packaging, such as die stacking, in most cases the discrete components remain unchanged. Market pressures are now forcing improvements in the current discrete packaging.

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We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured chalk talk

PIC32CX-BZ2 and WBZ451 Multi-Protocol Wireless MCU Family
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Shishir Malav from Microchip explore the benefits of the PIC32CX-BZ2 and WBZ45 Multi-protocol Wireless MCU Family and how it can make IoT design easier than ever before. They investigate the components included in this multi-protocol wireless MCU family, the details of the software architecture included in this solution, and how you can utilize these MCUs in your next design.
May 4, 2023
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