industry news
Subscribe Now

STMicroelectronics Delivers Superior-Performing NFC Technology for Secure Contactless Payments and IoT Applications

Geneva, February 21, 2017 – STMicroelectronics has announced availability of its latest-generation NFC devices for contactless payments and data exchange. The new devices include the ST21NFCD NFC controller featuring the market-proven booster technology ST has recently acquired, and two new members in the ST54 System-in-Package (SiP) family that integrate the Company’s latest Secure Element technology.

The ST21NFCD chip features active load modulation for faster, smoother transactions over longer distances, delivering better user experiences in mobiles, wearables, or IoT devices. It supports card emulation, reader/writer and peer-to-peer communication modes, and contains eFlash to permit full firmware update. It supports the NFC Forum’s NCI 2.0 specification, which simplifies software development for interacting with NFC tags and supports batching and autonomous exchanges to minimize communication overheads. The IC also meets NFC Forum type 1-5 tag specifications, ISO/IEC 18092 NFC Interface and Protocol (NFCIP), and payment standards including EMVCo latest revisions. It is pre-certified in accordance with the Global Certification Forum (GCF) and PTCRB[1] for integration in mobile devices, and can enable handsets to read MIFARE ClassicTM encrypted tags.

Built-in power management and battery-voltage monitoring minimize any impact on runtime in a host-system such as a smartphone. The extremely high RF sensitivity, which allows the use of miniaturized antennas; the option to use an external clock source instead of a crystal; and the high output power of the chip that makes the DC/DC booster optional, each help save bill of materials and board footprint.

ST’s latest ST54 Systems-in-Packages – ST54F and ST54H – contain the ST21NFCD NFC controller and an embedded Secure Element (eSE). The eSE is an ST33 secure microcontroller certified to the highest security standards including Common Criteria EAL5+ and EMVCo for financial applications, which ensures strong protection against duplication and hacking in a compact and easy-to-use integrated device. It leverages the proven ARM® SecurCore® SC300™ core and supports secure operating systems (OS) running Java Card™ and GlobalPlatform™.

The ST54F integrates the ST21NFCD with the widely deployed ST33G1M2 Secure Element with up to 1.28MB of eFlash. The ST54H embeds a more advanced ST33J2M0 Secure Element with up to 2MB eFlash and twice the performance of the ST33G1M2 to connect with new digital secure applications from service providers.

The ST21NFCD and the new ST54 SiPs are in volume production, each packaged as a 4mm x 4mm x 0.8mm 64-pin WFBGA. Please contact your ST sales office for pricing options and sample requests.

ST’s latest NFC devices will be on show at Mobile World Congress in Barcelona (Feb 27-Mar 2, Booth 7A61).

For further information please visit http://www.st.com/en/secure-mcus/secure-nfc.html

Leave a Reply

featured blogs
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Electromagnetic Compatibility (EMC) Gasket Design Considerations
Electromagnetic interference can cause a variety of costly issues and can be avoided with a robust EMI shielding solution. In this episode of Chalk Talk, Amelia Dalton chats with Sam Robinson from TE Connectivity about the role that EMC gaskets play in EMI shielding, how compression can affect EMI shielding, and how TE Connectivity can help you solve your EMI shielding needs in your next design.
Aug 30, 2023
28,755 views