industry news
Subscribe Now

Diodes Incorporated to Unveil Packet Switches, Dual MOSFETs and Transient Voltage Suppressors at Embedded World 2017

See Diodes in Hall 3A, Booth 431

Nuremberg, Germany – February 16th, 2017 – Diodes Incorporated will be introducing a number of notable new products at Embedded World 2017 in Nuremberg, Germany, March 14-16. These include the industry’s first unidirectional 1800W automotive-compliant transient voltage suppressors; 40V and 60V dual, co-packaged enhancement mode MOSFETs that are also qualified for automotive applications; and, coming from its Pericom connectivity product line, the world’s first and only automotive, AEC-Q100 grade, PCIe Packet Switches.

“What better place to unveil automotive solutions than in Germany, home to some of the world’s leading automobile manufacturers, and at a show that is dedicated to the design of embedded electronic systems”, said Oliver Woyke, Diodes’ Director of Sales for Europe, Middle East & Africa, “The combination of traditional discrete, logic, analog and mixed-signal semiconductor products with our connectivity and timing product line means Diodes is even better placed to serve the embedded market and especially the automotive industry”.

Vehicle telematics and infotainment systems demand connectivity that meets both the latest communication standards and automotive reliability criteria. Representing the first-ever packet switches to be automotive-qualified to AEC-Q100 grade 3, are two members of Diodes PI7C9X2G PCI Express® 2.0 family. These parts provide 3?port/4?lane and 4?port/4?lane configurations while for non-automotive applications, such as embedded, networking and storage, Diodes is also introducing 9?port/12?lane and 16?port/16?lane versions. The automotive versions of these packet switches also have an integrated clock buffer to ease design and lower BOM cost, and feature advanced power management and support hot-plug operation.

Diodes’ new transient voltage suppressor (TVS) design is uniquely capable of handling repetitive reverse avalanche pulses up to a peak pulse power dissipation of 1800W, some 20% higher than alternative surface mount component (SMC) products. Additionally, the device has been engineered to fit into a low-profile, thermally efficient PowerDI5 package that is half the height of the industry standard SMC package and has a 40% smaller PCB footprint. Qualification to AEC-Q101 supported by a PPAP (production part approval process) provides the essential high reliability and traceability required for this device’s target applications in automotive infotainment, navigation and advanced driver assistance systems.

Aimed at similar automotive end-applications to the TVS devices, the latest 40V and 60V dual, co-packaged enhancement mode MOSFETs introduced by Diodes aim to minimize power losses in order to deliver cost-effective, high-efficiency power management designs. For example, when used to build a DC-DC converter using with a PWM control IC, the 60V device can achieve 95% efficiency while delivering a 5V output at a load current of 2A. Both devices are qualified to the AEC-Q101 Rev D high-reliability standard and supported by PPAP.

Diodes will be exhibiting on Booth 431 in Hall 3A, and welcomes visitors to come and find out more about these exciting new products. 

Further information will also be available at http://www.diodes.com

About Diodes Incorporated

Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor’s SmallCap 600 and Russell 3000 Index company, is a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets. Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets. Diodes’ products include diodes, rectifiers, transistors, MOSFETs, protection devices, function-specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors, power management devices, including LED drivers, AC-DC converters and controllers, DC-DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers. Diodes’ corporate headquarters and Americas’ sales office are located in Plano, Texas and Milpitas, California. Design, marketing, and engineering centers are located in Plano; Milpitas; Taipei, Taiwan; Taoyuan City, Taiwan; Zhubei City, Taiwan; Manchester, England; and Neuhaus, Germany. Diodes’ wafer fabrication facilities are located in Kansas City, Missouri and Manchester, with an additional facility located in Shanghai, China. Diodes has assembly and test facilities located in Shanghai, Jinan, Chengdu, and Yangzhou, China, as well as in Hong Kong, Neuhaus and Taipei. Additional engineering, sales, warehouse, and logistics offices are located in Taipei; Hong Kong; Manchester; Shanghai; Shenzhen, China; Seongnam-si, South Korea; and Munich, Germany, with support offices throughout the world.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

ROHM's 4th Generation SiC MOSFET
In this episode of Chalk Talk, Amelia Dalton and Ming Su from ROHM Semiconductor explore the benefits of the ROHM’s 4th generation of silicon carbide MOSFET. They investigate the switching performance, capacitance improvement, and ease of use of this new silicon carbide MOSFET family.
Jun 26, 2023
35,616 views