industry news
Subscribe Now

Registration for Worldwide MEMS Design Contest Opens

SAN JOSE, Calif., November 2, 2016—Cadence Design Systems, Inc. (NASDAQ: CDNS), Coventor, X-FAB and Reutlingen University have teamed up to launch the MEMS design contest to encourage the development of innovative MEMS and mixed-signal designs. The first-prize winner will receive a $5000 cash award, have their design manufactured at X-FAB’s wafer production facilities and get a free one-year license of Coventor’s MEMS design software. The second and third prize winners will receive $2,000 and $1,000 cash prizes respectively, along with a private tour of X-FAB’s foundry facilities. The contest registration is open until December 31, 2016, and design teams are encouraged to enter the contest at http://info.coventor.com/mems-design-contest-2018

“We are looking forward to seeing innovative, creative designs from companies, entrepreneurs, researchers and students from around the globe,” said Dr. Stephen R. Breit, vice president of engineering at Coventor. “All four organizations behind this effort are committed to furthering the integration of MEMS design, mixed-signal design and device fabrication.” 

To support contest registrants, the organizers will provide free training workshops to help participating design teams become familiar with the design tools, methodologies and process technologies needed to create their MEMS and mixed-signal designs. Participants will also receive free access to various IP blocks that can be used as part of their design such as digital SC, I/Os, RAM and ROM blocks.

The contest results will be announced, and prizes will be awarded at the annual Cadence user conference, CDNLive EMEA, in Munich, Germany, in 2018. The key dates for the contest are: 

December 31, 2016: Entry deadline 

March 1, 2017: Entry acceptance notification; design phase starts

December 31, 2017: Design submission deadline

February 28, 2018: Prize announcements 

CDNLive EMEA 2018: Awards ceremony

About the Contest Organizers

Cadence Design Systems http://www.cadence.com/ enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. 

X-FAB http://www.xfab.com/ is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs more than 3,800 people worldwide. 

Coventor, Inc. http://www.coventor.com/mems-solutions is the market leader in automated design solutions for developing semiconductor process technology and micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations from its headquarters in Cary, North Carolina, and offices in Silicon Valley, California, Waltham, Massachusetts, and Paris, France. 

Reutlingen University http://www.reutlingen-university.de/ is one of Germany’s leading universities, offering international academic programs with close ties to industry and commerce. It will help formulate and organize the call for participation of the contest. 

Leave a Reply

featured blogs
Apr 25, 2024
Cadence's seven -year partnership with'¯ Team4Tech '¯has given our employees unique opportunities to harness the power of technology and engage in a three -month philanthropic project to improve the livelihood of communities in need. In Fall 2023, this partnership allowed C...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

The Future of Intelligent Devices is Here
Sponsored by Alif Semiconductor
In this episode of Chalk Talk, Amelia Dalton and Henrik Flodell from Alif Semiconductor explore the what, where, and how of Alif’s Ensemble 32-bit microcontrollers and fusion processors. They examine the autonomous intelligent power management, high on-chip integration and isolated security subsystem aspects of these 32-bit microcontrollers and fusion processors, the role that scalability plays in this processor family, and how you can utilize them for your next embedded design.
Aug 9, 2023
30,451 views