industry news
Subscribe Now

Melexis Announces Pioneering Use of MEMS in Mid-Range Pressure Sensing Applications

Tessenderlo, Belgium, 20th October 2016 – Melexis, the global microelectronics company enabling future innovation through a philosophy of inspired engineering, continues to bring highly differentiated products to market through superior innovation, with the introduction of its MLX90819 sensor IC – which is targeted at measuring mid pressure (10-50bar) levels. Applying its proprietary micro-electro-mechanical system (MEMS) technology to an area that had not been previously adequately served by a fully integrated sensor solution means that major system design benefits can now be derived.

Available as a bare die, the MLX90819 runs off a standard 5V supply. It can be employed to accurately determine fluid pressure levels in wide variety of automotive and industrial focused applications. These include the monitoring of engine oil, transmission oil, engine coolant, vehicle fuel lines, air conditioning refrigerant and truck air brake pressures, just to mention a few. The IC delivers a relative pressure value. It has a 1ms response time, plus ±2.5% over life accuracy and ±0.2% linearity across its entire operational pressure range. 

By using a more advanced process technology, the MLX90819 is unique in being able to leverage a microcontroller based architecture. This allows a much higher degree of sophistication to be incorporated onto the semiconductor die – with all digital processing, data conversion, temperature offset, gain compensation and filtering tasks being taken care of directly. A 16-bit analog-to-digital converter (ADC), 12-bit digital-to-analog (DAC) and high performance 16-bit processor core are embedded directly into each sensor IC. The cost and complexity implications of discrete MEMS solutions, as well as the space utilization and sealing wear-and-tear issues that blight traditional non-MEMS solutions, can thereby be avoided. The IC can deliver either an analog signal or a single edge nibble transmission (SENT) output for applications requiring a digital output.

This robust IC is highly suited to both heavy duty industrial and automotive deployment, with full AECQ100 compliance and a specified temperature range of -40°C to 150°C. An automotive over-voltage protection mechanism is included in order to ensure ongoing reliability. An array of diagnostic features further support its long term operational integrity. These include analog output clamping level and broken track detection, plus numerous distinctive diagnostic messages passed via the SENT protocol (such as internal temperature or pressure errors, external over-voltage/under-voltage conditions, etc.) The MLX90819 sensor ICs will be shipped in a die-on-foil format.

“This new approach to mid-range pressure measurement will clearly be appealing to engineering teams, as it presents them with the sensor technology they need to reduce test/assembly effort, lower component counts and save valuable space,” comments Laurent Otte, Product Line Manager for Pressure Sensors at Melexis. “The streamlined nature of the MLX90819 greatly facilitates the sensor system’s mechanical integration into customers’ modules, as only a PCB with a limited number of external components will be required. There is thus considerable potential to scale down the dimensions of the module into which it is housed.”

For more information on MLX90819 please visit www.melexis.com/en/product/MLX90819/

About Melexis

Combining a passion for technology with truly inspired engineering, Melexis designs, develops and delivers innovative micro-electronic solutions that enable designers to turn ideas into applications that support the best imaginable future. The company’s advanced mixed-signal semiconductor sensor and actuator components address the challenges of integrating sensing, driving and communication into next-generation products and systems that improve safety, raise efficiency, support sustainability and enhance comfort.

A world leader in automotive semiconductor sensors, Melexis has used its core experience in creating chips for vehicle electronics to expand its portfolio of sensors, driver ICs and wireless devices to also meet the needs of smart appliances, home automation, industrial and medical applications. Melexis sensing solutions include magnetic sensors, MEMS sensors (pressure, TPMS, infrared), sensor interface ICs, optoelectronic single point and linear array sensors and Time of Flight. The company’s driver IC portfolio incorporates advanced DC & BLDC motor controllers, LED drivers and FET pre-driver ICs, while Melexis has the know-how and expertise to build bridges between components, allowing them to communicate in a clear and fast way, whether wired (e.g. LIN, SENT) or wireless (RKE, RFID).

Melexis is headquartered in Belgium and employs over 1,100 people in 19 locations worldwide. The company is publicly traded on Euronext Brussels (MELE).

 

For more information, visit www.melexis.com

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Achieve Greater Design Flexibility and Reduce Costs with Chiplets

Sponsored by Keysight

Chiplets are a new way to build a system-on-chips (SoCs) to improve yields and reduce costs. It partitions the chip into discrete elements and connects them with a standardized interface, enabling designers to meet performance, efficiency, power, size, and cost challenges in the 5 / 6G, artificial intelligence (AI), and virtual reality (VR) era. This white paper will discuss the shift to chiplet adoption and Keysight EDA's implementation of the communication standard (UCIe) into the Keysight Advanced Design System (ADS).

Dive into the technical details – download now.

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
33,617 views