industry news
Subscribe Now

New STM32L4 Microcontrollers from STMicroelectronics Extend Choices, Deliver Best Energy Efficiency in ARM® Cortex®-M4 Class

Geneva, February 11, 2016 – STMicroelectronics has taken microcontroller power savings and performance to new heights with its latest STM32L4 series devices. The new microcontrollers also introduce peripheral and package configurations that simplify design and increase flexibility.

According to the EEMBC® ULPBench™ tests for low-power microcontrollers, the new STM32L4 devices achieve 176.70 ULPMark™-CP[1], vaulting over the scores of other major brands, without the help of a buck converter that adds external components such as a coil and capacitor. The EEMBC CoreMark® score of 273.55 at 80MHz shows that the STM32L4 series delivers an unrivalled combination of high peak performance and energy efficiency.

The performance and efficiency advantages come from smart architectural features such as independently adjustable peripheral supply voltages and a programmable multi-speed internal clock, as well as Batch Acquisition Mode (BAM) and ST’s Adaptive Real-Time Accelerator (ART Accelerator™). In addition, multiple power-management modes, including ultra-low-power 8nA shutdown, help maximize energy savings.

Designers can now access these advantages in six new STM32L4 lines that offer economy, a range of application-targeted features, and extra package choices. The STM32L471 combines up to 1MB Flash with rich analog and audio features for projects that require no LCD controller or USB connectivity. The STM32L475 has a USB OTG Full Speed controller, and both devices have multiple timers, clock sources, and communication interfaces including CAN, SDMMC, USART, SPI, and I2C. The analog peripherals include 12-bit ADCs with 5 MSPS capability and power-saving modes, as well as two 12-bit DACs, two op-amps with built-in Programmable-Gain Amplifier (PGA), and two ultra-low-power comparators.

The STM32L432 and STM32L433 bring 100DMIPS ARM® Cortex®-M4 core performance to lightweight applications that require up to 256KB Flash. Analog and audio features combine with a crystal-less USB controller in the STM32L432. The STM32L433 additionally features an LCD controller. Both lines support extra package options, from 7mm x 7mm UFBGA100 to 3.14mm x 3.13mm WLCSP49, including the small-footprint UFQPN32 for customers without WLCSP-assembly capability.

In addition, the STM32L442 and STM32L443 lines offer designers the same strong feature sets and flexibility as the STM32L432/433, with the addition of a cryptographic accelerator in each device.

The extra choices in the STM32L4 series enhance choice and flexibility for designers who need to secure smart connected Internet-of-Things (IoT) devices, such as wearables or home-automation controllers, or need versatile peripherals and connectivity for industrial or medical devices. In addition, guaranteed product availability for more than 10 years makes the STM32L4 series ideal for smart meters, also benefiting from the wide temperature range and high on-chip memory density to achieve a robust single-chip solution. 

Budgetary pricing is from $2.13 for the STM32L432KBU6 with 128KB Flash and 64KB SRAM in QFN-32 package, for orders of 10,000 pieces. The new lines are scheduled to enter volume production during Q1 and Q2 2016.

Tune in for ST’s Embedded World videos, recorded live from the show, available from Feb 24, 2016 atwww.youtube.com/stonlinemedia/EW2016

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Nexperia Energy Harvesting Solutions
Sponsored by Mouser Electronics and Nexperia
Energy harvesting is a great way to ensure a sustainable future of electronics by eliminating batteries and e-waste. In this episode of Chalk Talk, Amelia Dalton and Rodrigo Mesquita from Nexperia explore the process of designing in energy harvesting and why Nexperia’s inductor-less PMICs are an energy harvesting game changer for wearable technology, sensor-based applications, and more!
May 9, 2023
40,790 views