industry news
Subscribe Now

Ericsson’s 60A digital point-of-load DC/DC converter delivers industry-leading power density and scalability

  • Power density of 395A/in3 delivers 60A from 0.98 x 0.55 x 0.276in package
  • 60A single-phase point-of-load DC/DC converters can be connected in parallel to deliver up to 480A
  • Typically half the size than designs using discrete components
  • Market leading compact LGA package offers design flexibility for enhanced thermal performance
  • A high-performance, flexible power solution for all markets, especially ICT, telecom and industrial applications

Ericsson today announced the launch of a new 60A 3E* digital point-of-load (POL) DC/DC power module, the BMR466, designed to power microprocessors, FPGAs, ASICs and other digital ICs on complex boards. Up to eight of the fully regulated 60A (maximum) POL converters can be connected in parallel to deliver up to 480A in multi-module and multi-phase systems. This produces an economical, efficient and scalable power solution with a small footprint, high stability, advanced loop compensation and class-leading thermal characteristics. The LGA-packaged BMR466 brings exceptional design flexibility to reliable, high-current, low voltage power systems.

Ideally suited for deployment in distributed power and intermediate bus voltage architectures within the ICT (Information and Communication Technology), telecom and industrial sectors, the module targets high-power and high-performance use in products such as networking and telecommunications equipment, servers and data storage applications, as well as industrial equipment.

The BMR466 LGA footprint is 0.98 x 0.55in and it has an exceptionally low profile of 0.276in, which facilitates compact system design. Spreading the placement of the 60A units across printed circuit boards means that heat dissipation can be distributed, optimizing the use of multi-layer board technology and simplifying cooling arrangements. In addition, the use of a surface-mount LGA package with symmetric contact layout offers superior mechanical contact and high reliability after soldering. The elimination of connecting leads results in lower inductance, enabling excellent noise and EMI characteristics. This is further enhanced because a high number of the LGA contacts are ground pins.

Through software control, the BMR466 uses class-leading adaptive compensation of the PWM control loop and advanced energy-optimization algorithms to reduce energy consumption and deliver a stable and secure power supply with fast transient performance over a wide range of operating conditions. In multi-module systems, two or more of the single-phase BMR466 POL converters can be synchronized with an external clock to enable phase spreading, which means the reduction of input ripple current and corresponding capacitance requirements and efficiency losses. The ripple current can be estimated using the Ericsson Power Designer (EPD) software tool, which enables easy capacitor selection. The BMR466 is also fully compliant with PMBus commands and has been integrated into the EPD software, which makes it easy for power system architects to simulate and configure complete multi-module and multi-phase systems prior to implementation. This cuts time-to-market.

Operating from a 4.5V to 14V input, the BMR466 is ideally suited to operation across a range of intermediate bus voltages and complies with the Dynamic Bus Voltage scheme to reduce power dissipation and save energy. The factory default output voltage is set to 1.2V, but can be adjusted from 0.6V to 1.8V either via a pin-strap resistor or PMBus commands. The BMR465 powertrain guarantees high efficiency and reliability and is built from the latest generation of power transistor semiconductors, enabling the module to deliver up to 94.9% with a 5V input and a 1.8V output, at half load.

Other device features include an MTBF of 50 million hours (based on Telcordia SR-332 Issue 3, Method 1.) and protection features include input-under-voltage shutdown, over-temperature protection, output-short-circuit and over-voltage protection, and remote control and Power Good.

“The BMR466 deploys a combination of best-in-class power density design, advanced power transistor technologies, automatic compensation techniques and excellent thermal performance characteristic with all the advantages of digital control to deliver out-of-the-box stable and secure performance,” said Martin Hägerdal, President, Ericsson Power Modules. “As well as significant competitive advantages, the 60A POL module also offers time-to-market benefits and only half of the size saving premium board space.”

The BMR466 has been designed and manufactured by Ericsson to meet the highest standards available for DC/DC power converters in the industry, delivering the levels of quality and confidence that are required by power system designers to develop long-term and high-performance platforms.

Available in production now, the BMR466 is priced at $18.5 in OEM quantities.

* 3E – Enhanced Performance, Energy Management, and End-user Value are the key benefits delivered by Ericsson’s range of 3E digitally controlled DC/DC converters.

About Ericsson Power Modules
http://www.ericsson.com/powermodules

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Portenta C33
Sponsored by Mouser Electronics and Arduino and Renesas
In this episode of Chalk Talk, Marta Barbero from Arduino, Robert Nolf from Renesas, and Amelia Dalton explore how the Portenta C33 module can help you develop cost-effective, real-time applications. They also examine how the Arduino ecosystem supports innovation throughout the development lifecycle and the benefits that the RA6M5 microcontroller from Renesas brings to this solution.  
Nov 8, 2023
22,499 views