industry news
Subscribe Now

ams schedules 2015 multi-project wafer starts for analog foundry customers

Unterpremstaetten, Austria (November 17, 2014), The Full Service Foundry division of ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today announced its fast and cost-efficient IC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with an updated schedule for 2015. The prototyping service, which combines several designs from different customers onto a single wafer, offers significant cost advantages for foundry customers as the costs for wafers and masks are shared among a number of different shuttle participants.

As a further extension of its “More than Silicon” initiative, ams now provides advanced packaging services to its shuttle participants by offering WLCSP (Wafer Level Chip Scale Packaging) on selected MPW runs within 2015. This unique combination of fast prototyping service plus chip scale packaging offers large cost savings and great flexibility to foundry customers.

ams’ best in class MPW service includes the whole range of 0.18?m and 0.35?m specialty processes. In order to provide leading analog semiconductor process technologies, manufacturing and services, ams offers four MPW runs in 0.18?m CMOS (C18) process as well as four MPW runs in its advanced 0.18?m High-Voltage CMOS (H18) technology supporting 1.8V, 5V, 20V and 50V devices. For the 0.35?m specialty processes, which are based on the 0.35?m CMOS process transferred from TSMC (Taiwan Semiconductor Manufacturing Company), a total of 14 runs are offered in 2015. ams’ 0.35?m High-Voltage CMOS process family, optimized for high-voltage designs in automotive and industrial applications, supports 20V, 50V and 120V devices. The advanced High-Voltage CMOS process with embedded EEPROM functionality as well as the 0.35?m SiGe-BiCMOS technology S35 are fully compatible to the base CMOS base process and complete ams’ MPW service portfolio.

Overall, ams will offer almost 150 MPW start dates in 2015, enabled by long lasting co-operations with partner organizations such as CMP,EuropracticeFraunhofer IIS and Mosis.

The complete schedule for 2015 has now been released and detailed start dates per process are available on the web at http://asic.ams.com/MPW.

To take advantage of the MPW service, ams’ foundry customers deliver their completed GDSII-data on specific dates and receive untested packaged samples or dies within a short lead-time of typically 8 weeks for CMOS and 12 weeks for High-Voltage CMOS, SiGe-BiCMOS and Embedded Flash processes.

All process technologies are supported by the well-known hitkit, ams’ industry benchmark process design kit based on Cadence, Mentor Graphics or Keysight ADS design environments. The hitkit comes complete with fully silicon-qualified standard cells, periphery cells and general purpose analog cells such as comparators, operational amplifiers, low power A/D and D/A converters. Custom analog and RF devices, physical verification rule sets for Assura and Calibre, as well as precisely characterized circuit simulation models, enable rapid design starts of complex high performance mixed-signal ICs. In addition to standard prototype services, ams also offers advanced analog IP blocks, a memory (RAM/ROM) generation service and packaging services in ceramic or plastic. 

about the Full Service Foundry division of ams

The Full Service Foundry division of ams has successfully positioned itself in the analog/mixed-signal foundry market. Its process technology portfolio includes 0.18µm and 0.35µm specialty technologies based on ams analog, mixed-signal, high-voltage and RF processes. With its ‘More than Silicon’ initiative, ams offers a comprehensive service and technology package that goes beyond industry-standard foundry services. It includes leading-edge technology extensions such as 3D ICs using Through Silicon Vias, color coating, back end process customization, WLCSP and many more. Superior support during the design phase, high-end tools and experienced engineers, silicon-proven high-performance analog IP blocks, assembly and test services for turnkey solutions complete the Full Service Foundry package.

About ams

ams is a global leader in the design and manufacture of advanced sensor solutions and analog ICs. Our mission is to shape the world with sensor solutions by providing a seamless interface between humans and technology. ams’ high-performance analog products drive applications requiring extreme precision, dynamic range, sensitivity, and ultra-low power consumption. Products include sensors, sensor interfaces, power management and wireless ICs for consumer, communications, industrial, medical, and automotive markets.

With headquarters in Austria, ams employs over 1,600 people globally and serves more than 8,000 customers worldwide. ams is listed on the SIX Swiss stock exchange (ticker symbol: AMS). More information about ams can be found at www.ams.com.

Leave a Reply

featured blogs
Apr 19, 2024
In today's rapidly evolving digital landscape, staying at the cutting edge is crucial to success. For MaxLinear, bridging the gap between firmware and hardware development has been pivotal. All of the company's products solve critical communication and high-frequency analysis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured chalk talk

USB Power Delivery: Power for Portable (and Other) Products
Sponsored by Mouser Electronics and Bel
USB Type C power delivery was created to standardize medium and higher levels of power delivery but it also can support negotiations for multiple output voltage levels and is backward compatible with previous versions of USB. In this episode of Chalk Talk, Amelia Dalton and Bruce Rose from Bel/CUI Inc. explore the benefits of USB Type C power delivery, the specific communications protocol of USB Type C power delivery, and examine why USB Type C power supplies and connectors are the way of the future for consumer electronics.
Oct 2, 2023
25,547 views