industry news
Subscribe Now

Spansion Strengthens Automotive Flash Memory Portfolio

SUNNYVALE, Calif., April 24, 2014 /PRNewswire/ — Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, today strengthened the company’s automotive flash memory portfolio by introducing six automotive-grade devices to the company’s flash memory portfolio. Spansion is adding three new Serial NOR and three new NAND memory densities specifically qualified to meet the extended temperature ranges and stringent quality requirements of the automotive industry.

Spansion is complementing the Spansion FL1-K Serial NOR flash family with automotive devices qualified for extended temperature ranges (from -40 degrees Celsius to 125 degrees Celsius) in 16Mb, 32Mb, and 64Mb densities. Spansion is also introducing automotive-grade Spansion ML-G1 NAND flash memories qualified for -40C to 105 degrees Celsius, in 1Gb, 2Gb and 4Gb densities. All six new Spansion devices have achieved AEC-Q100 qualification and meet Production Part Approval Process (PPAP) requirements, industry standards for automotive grade products. 

“With our broad portfolio of automotive-grade flash memories and proven quality, technical support and product longevity, Spansion has maintained its leadership in automotive flash devices for more than 20 years,” said Robin Jigour, senior vice president, Spansion Flash Memory Group. “Automotive OEMS are increasing their demand for automotive grade components as applications like Advanced Driver Assistance Systems (ADAS), instrument clusters, infotainment and data logging systems become standard offerings in a wider range of vehicles.”

“Extremely high reliability and the ability to operate at wide temperature variances are among the most critical needs of automotive applications,” said Alan Niebel, founder and CEO, WebFeet Research. “Automotive-grade devices with AEC-Q100 qualification, which follow PPAP, meet the most stringent requirements defined by automakers worldwide. Spansion’s active role in the development, test, delivery and support of high-performance, high-quality embedded systems for automotive has led to their market leadership.”

In addition to automotive applications, automotive grade flash memories are ideal in the industrial space for solar inverters, power switches, factory automation and safety monitoring devices.

Spansion’s new automotive serial NOR flash part numbers include: S25FL116K (16Mb), S25FL132K (32Mb) and S25FL164K (64Mb).  The new automotive NAND flash products include: S34ML01G1 (1Gb), S34ML02G1 (2Gb) and S34ML04G1 (4Gb). 

Resources:

About Spansion

Spansion (NYSE: CODE) is a global leader in embedded systems solutions. Spansion’s flash memory, microcontrollers, analog and mixed-signal products drive the development of faster, intelligent, secure and energy efficient electronics. Spansion is at the heart of electronics systems, connecting, controlling, storing and powering everything from automotive electronics and industrial systems to the highly interactive and immersive consumer devices that are enriching people’s daily lives. For more information, visithttp://www.spansion.com

Spansion®, the Spansion logo, HyperBus™, HyperFlash™ and combinations thereof, are trademarks or registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Medical Grade Power
Sponsored by Mouser Electronics and RECOM
In this episode of Chalk Talk, Amelia Dalton and Louis Bouche from RECOM explore the various design requirements for medical grade power supplies. They also examine the role that isolation and leakage current play in this arena and the solutions that RECOM offers in terms of medical grade power supplies.
Nov 9, 2023
21,612 views